"Electromigration-aware placement for 3D-ICs."

Tiantao Lu, Zhiyuan Yang, Ankur Srivastava (2016)

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DOI: 10.1109/ISQED.2016.7479173

access: closed

type: Conference or Workshop Paper

metadata version: 2022-11-17

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Tiantao Lu, Zhiyuan Yang, Ankur Srivastava:
Electromigration-aware placement for 3D-ICs. ISQED 2016: 35-40

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