"Cooling architectures using thermal sidewalls, interchip plates, and ..."

Kaoru Furumi, Masashi Imai, Atsushi Kurokawa (2017)

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DOI: 10.1109/ISQED.2017.7918329

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-11

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Kaoru Furumi, Masashi Imai, Atsushi Kurokawa:
Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs. ISQED 2017: 283-288

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