"Full-Chip Electro-Thermal Coupling Extraction and Analysis for ..."

Lingjun Zhu et al. (2020)

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DOI: 10.1145/3372780.3378169

access: closed

type: Conference or Workshop Paper

metadata version: 2025-11-06

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  - conf/ispd/ZhuCPSYL20
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Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim:
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. ISPD 2020: 39-46

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