"Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ..."

Pruek Vanna-Iampikul et al. (2025)

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DOI: 10.1145/3698364.3705357

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-09

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Pruek Vanna-Iampikul, Jun-Sik Yoon, Chaeryung Park, Gary Yeap, Sung Kyu Lim:
Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs. ISPD 2025: 200-208

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