"Arrangement of Vias to Connect a PCB Ground Plane in a Common-Source ..."

Jian-Ming Wu et al. (2021)

> Home

Details and statistics

DOI: 10.1109/ISPACS51563.2021.9651015

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-12

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ispacs/WuYLY21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ispacs/WuYLY21
Jian-Ming Wu, Tzong-Lin Yang, Yuan-Chih Lin, Min-Lang Yang:
Arrangement of Vias to Connect a PCB Ground Plane in a Common-Source Amplifier. ISPACS 2021: 1-2

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.