"Influence of Silver Glue on the Die Bonding Process of MEMS Gas Sensors."

Shi-Yan Fang et al. (2021)

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DOI: 10.1109/ISPACS51563.2021.9651009

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-12

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Shi-Yan Fang, Yu-Quan Zhuang, Ting-Jen Hsueh, Tien-Tsorng Shih:
Influence of Silver Glue on the Die Bonding Process of MEMS Gas Sensors. ISPACS 2021: 1-2

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