"A TSV test structure for simultaneously detecting resistive open and ..."

Young-Woo Lee et al. (2016)

> Home

Details and statistics

DOI: 10.1109/ISOCC.2016.7799724

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/isocc/LeeKCK16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isocc/LeeKCK16
Young-Woo Lee, Junghwan Kim, Inhyuk Choi, Sungho Kang:
A TSV test structure for simultaneously detecting resistive open and bridge defects in 3D-ICs. ISOCC 2016: 129-130

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.