"Wafer-level Packaging Platform for MEMS Sensor Applications."

Taehyun Kim et al. (2024)

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DOI: 10.1109/ISOCC62682.2024.10762282

access: closed

type: Conference or Workshop Paper

metadata version: 2024-12-19

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Taehyun Kim, Junmo Yang, Chungmo Yang, Sung-Hoon Choa, Hee Yeoun Kim:
Wafer-level Packaging Platform for MEMS Sensor Applications. ISOCC 2024: 238-239

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