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"Electrical and Thermal Analysis of Cu-CNT Composite TSV and GNR Interconnects."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Komal Sable, Manodipan Sahoo (2020)

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DOI: 10.1109/ISDCS49393.2020.9262991

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-03

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  dblp key:
  - conf/isdcs/SableS20
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  - https://dblp.org/rec/conf/isdcs/SableS20
Komal Sable, Manodipan Sahoo:
Electrical and Thermal Analysis of Cu-CNT Composite TSV and GNR Interconnects. ISDCS 2020: 1-6

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