"Electromigration Early Failures for Cu Pillar Interconnections with an ..."

Hideaki Tsuchiya et al. (2019)

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DOI: 10.1109/IRPS.2019.8720501

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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Hideaki Tsuchiya, Naohito Suzumura, Ryuji Shibata, Hideki Aono, Makoto Ogasawara, Toshihiko Akiba, Kenji Sakata, Kazuyuki Nakagawa, Takuo Funaya:
Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. IRPS 2019: 1-6

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