"Introduction to Voltage-Ramping Wafer Level Electromigration Method and ..."

Da Yong Shin et al. (2025)

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DOI: 10.1109/IRPS48204.2025.10982900

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

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Da Yong Shin, Hyunjun Choi, Joosung Kim, Myungsoo Yeo, Miji Lee, Taiki Uemura, Shin-Young Chung, Jong-Ho Lee:
Introduction to Voltage-Ramping Wafer Level Electromigration Method and Current Exponent Correction Factor for Co-Capping Metal Lines. IRPS 2025: 1-5

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