"Thermomechanical Fatigue in Two Level Cu Interconnects Under Pulsing Peak ..."

Hariram Mohanram et al. (2025)

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DOI: 10.1109/IRPS48204.2025.10983661

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

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Hariram Mohanram, Harikrishnan Kumarasamy, Choong-Un Kim, Young-Joon Park, Sudarshan Prasad, Srikanth Krishnan:
Thermomechanical Fatigue in Two Level Cu Interconnects Under Pulsing Peak Current. IRPS 2025: 42

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