"Verification of Copper Stress Migration Under Low Temperature Long Time ..."

Hideya Matsuyama et al. (2019)

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DOI: 10.1109/IRPS.2019.8720511

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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Hideya Matsuyama, Takashi Suzuki, Motoki Shiozu, Hideo Ehara, Takeshi Soeda, Hirokazu Hosoi, Masao Oshima, Kikuo Yamabe:
Verification of Copper Stress Migration Under Low Temperature Long Time Stress. IRPS 2019: 1-5

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