"A Comparison of Environmental Stressing Data and Simulation at the Corner ..."

Sandeep Mallampati et al. (2019)

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DOI: 10.1109/IRPS.2019.8720597

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

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Sandeep Mallampati, Zaeem Baig, Scott Pozder, Eng Chye Chua:
A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package. IRPS 2019: 1-4

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