"Assesment of CPI Stress Impact on IC Reliability and Performance in ..."

Armen Kteyan et al. (2019)

> Home

Details and statistics

DOI: 10.1109/IRPS.2019.8720471

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-31

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/KteyanHCS19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/KteyanHCS19
Armen Kteyan, Henrik Hovsepyan, Jun-Ho Choy, Valeriy Sukharev:
Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. IRPS 2019: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.