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"Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Lin Hou et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764478

access: closed

type: Conference or Workshop Paper

metadata version: 2026-01-04

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Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne:
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. IRPS 2022: 4

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last updated on 2026-01-04 13:43 CET by the dblp team

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