"Moisture diffusion rate in an ultra-low-k dielectric and its effect on the ..."

Ning Duan et al. (2021)

> Home

Details and statistics

DOI: 10.1109/IRPS46558.2021.9405157

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-20

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/DuanSOESB21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/DuanSOESB21
Ning Duan, Vignesh Subramanian, Edgar Olthof, Paul Eggenkamp, Michiel van Soestbergen, Richard Braspenning:
Moisture diffusion rate in an ultra-low-k dielectric and its effect on the dielectric reliability. IRPS 2021: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.