"A novel TSV probing technique with adhesive test interposer."

Li Jiang et al. (2015)

Details and statistics

DOI: 10.1109/ICCD.2015.7357170

access: closed

type: Conference or Workshop Paper

metadata version: 2026-03-24

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.