"Known void size micro-bump, a novel standard of 3D X-ray computed ..."

Lay Wai Kong, Osborne A. Martin (2018)

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DOI: 10.1109/I2MTC.2018.8409573

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-19

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Lay Wai Kong, Osborne A. Martin:
Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring. I2MTC 2018: 1-5

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