"A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs."

Libao Deng et al. (2019)

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DOI: 10.1109/I2MTC.2019.8826873

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-18

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Libao Deng, Ning Sun, Ning Fu, Liyan Qiao:
A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs. I2MTC 2019: 1-6

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