"EIGEN: Enabling Efficient 3DIC Interconnect with Heterogeneous Dual-Layer ..."

Siyao Jia et al. (2025)

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DOI: 10.1109/HPCA61900.2025.00117

access: closed

type: Conference or Workshop Paper

metadata version: 2025-12-14

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Siyao Jia, Bo Jiao, Haozhe Zhu, Chixiao Chen, Qi Liu, Ming Liu:
EIGEN: Enabling Efficient 3DIC Interconnect with Heterogeneous Dual-Layer Network-on-Active-Interposer. HPCA 2025: 1573-1587

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