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"Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Arjun Chaudhuri et al. (2019)

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DOI: 10.1109/ETS.2019.8791515

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/ets/ChaudhuriBPKCL19
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  - https://dblp.org/rec/conf/ets/ChaudhuriBPKCL19
Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS 2019: 1-6

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