"Stacking order impact on overall 3D die-to-wafer Stacked-IC cost."

Mottaqiallah Taouil, Said Hamdioui (2011)

> Home

Details and statistics

DOI: 10.1109/DDECS.2011.5783107

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/ddecs/TaouilH11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ddecs/TaouilH11
Mottaqiallah Taouil, Said Hamdioui:
Stacking order impact on overall 3D die-to-wafer Stacked-IC cost. DDECS 2011: 335-340

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.