"MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for ..."

Tianxiang Zhu et al. (2025)

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DOI: 10.23919/DATE64628.2025.10993234

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type: Conference or Workshop Paper

metadata version: 2025-05-30

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Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang:
MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. DATE 2025: 1-7

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