"Cool3D: Cost-Optimized and Efficient Liquid Cooling for 3D Integrated ..."

Jing Li et al. (2025)

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DOI: 10.23919/DATE64628.2025.10993126

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-30

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Jing Li, Bingrui Zhang, Yuquan Sun, Wei Xing, Yuanqing Cheng:
Cool3D: Cost-Optimized and Efficient Liquid Cooling for 3D Integrated Circuits. DATE 2025: 1-7

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