"Fast chip-package-PCB coanalysis methodology for power integrity of ..."

Seungwon Kim et al. (2018)

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DOI: 10.23919/DATE.2018.8342132

access: closed

type: Conference or Workshop Paper

metadata version: 2018-04-24

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Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang:
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study. DATE 2018: 885-888

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