"An integrated algorithm for 3D-IC TSV assignment."

Xiaodong Liu et al. (2011)

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DOI: 10.1145/2024724.2024873

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-19

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Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng:
An integrated algorithm for 3D-IC TSV assignment. DAC 2011: 652-657

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