"3-D stacked die: now or future?"

Samta Bansal et al. (2010)

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DOI: 10.1145/1837274.1837350

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  - conf/dac/BansalRYJLMMR10
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  - https://dblp.org/rec/conf/dac/BansalRYJLMMR10
Samta Bansal, Juan C. Rey, Andrew Yang, Myung-Soo Jang, L. C. Lu, Philippe Magarshack, Pol Marchal, Riko Radojcic:
3-D stacked die: now or future? DAC 2010: 298-299

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