"Design for manufacturability and reliability for TSV-based 3D ICs."

David Z. Pan et al. (2012)

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DOI: 10.1109/ASPDAC.2012.6165055

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang:
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755

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