"A thermal model for the top layer of 3D integrated circuits considering ..."

Fengjuan Wang et al. (2011)

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DOI: 10.1109/ASICON.2011.6157281

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type: Conference or Workshop Paper

metadata version: 2017-05-25

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Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang:
A thermal model for the top layer of 3D integrated circuits considering through silicon vias. ASICON 2011: 618-620

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