"A 2.5D mm-size Wafer-level CMOS-IPD Wireless Power Transfer Receiver Using ..."

Kuei-Cheng Lin et al. (2019)

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DOI: 10.1109/APCCAS47518.2019.8953144

access: closed

type: Conference or Workshop Paper

metadata version: 2020-02-05

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Kuei-Cheng Lin, Po-Chang Wu, Yu-Chen Liu, Hann-Huei Tsai, Ying-Zong Juang:
A 2.5D mm-size Wafer-level CMOS-IPD Wireless Power Transfer Receiver Using Cross-coupled and Self-biasing Topology for Implantable Biomedical System. APCCAS 2019: 69-72

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