"SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in ..."

Hayden Gunraj et al. (2023)

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DOI: 10.1609/AAAI.V37I13.26858

access: open

type: Conference or Workshop Paper

metadata version: 2023-09-04

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Hayden Gunraj, Paul Guerrier, Sheldon Fernandez, Alexander Wong:
SolderNet: Towards Trustworthy Visual Inspection of Solder Joints in Electronics Manufacturing Using Explainable Artificial Intelligence. AAAI 2023: 15668-15674

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