"Within-tier cooling and thermal isolation technologies for heterogeneous ..."

Yue Zhang, Hanju Oh, Muhannad S. Bakir (2013)

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DOI: 10.1109/3DIC.2013.6702398

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Yue Zhang, Hanju Oh, Muhannad S. Bakir:
Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs. 3DIC 2013: 1-6

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