"16-Layer 3D Stacking Based on Self-Assembly Technology for HBM Application."

Du Zehua et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830117

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma, Tetsu Tanaka, Takafumi Fukushima:
16-Layer 3D Stacking Based on Self-Assembly Technology for HBM Application. 3DIC 2024: 1-3

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