"Copper-filled anodized aluminum oxide a potential material for chip to ..."

Kosuke Yamashita et al. (2015)

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DOI: 10.1109/3DIC.2015.7334589

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Kosuke Yamashita, Shunji Kurooka, Koji Shirakawa, Yoshinori Hotta, Hirofumi Abe:
Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. 3DIC 2015: TS8.1.1-TS8.1.5

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