"Characterization of the mechanical stress impact on device electrical ..."

Eric J. Wyers et al. (2015)

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DOI: 10.1109/3DIC.2015.7334597

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Eric J. Wyers, T. Robert Harris, Wallace Shep Pitts, Jordan E. Massad, Paul D. Franzon:
Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment. 3DIC 2015: TS8.27.1-TS8.27.4

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