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ORCID"Post-bond sub-500 nm alignment in 300 mm integrated face-to-face ..."
- Weng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum:
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding. 3DIC 2010: 1-6
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