"High-speed via hole filling using electrophoresis of Ag nanoparticles."

Ryo Takigawa et al. (2015)

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DOI: 10.1109/3DIC.2015.7334570

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano:
High-speed via hole filling using electrophoresis of Ag nanoparticles. 3DIC 2015: TS5.4.1-TS5.4.4

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