"Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for ..."

Jiayi Shen et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830202

access: closed

type: Conference or Workshop Paper

metadata version: 2025-10-14

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Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima:
Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous Integration of Micro-LED Array on 3D-IC. 3DIC 2024: 1-3

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