"Superconducting Titanium Nitride in Through-Silicon Vias for 3D ..."

Alexandra Schewski, Ulrich Schaber, Armin Klumpp (2024)

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DOI: 10.1109/3DIC63395.2024.10830265

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Alexandra Schewski, Ulrich Schaber, Armin Klumpp:
Superconducting Titanium Nitride in Through-Silicon Vias for 3D Integration of Qubits. 3DIC 2024: 1-6

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