"Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for ..."

Yoshiaki Satake et al. (2024)

> Home

Details and statistics

DOI: 10.1109/3DIC63395.2024.10830233

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/SatakeFDKOO24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/SatakeFDKOO24
Yoshiaki Satake, Tatsuya Funaki, Wataru Doi, Hajime Kato, Shogo Okita, Takayuki Ohba:
Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package. 3DIC 2024: 1-3

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.