"Best engineering practice for thermal characterization of stacked dice ..."

Arun Raghupathy et al. (2015)

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DOI: 10.1109/3DIC.2015.7334591

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Arun Raghupathy, Hoa Do, Brian Philofsky, Gamal Refai-Ahmed:
Best engineering practice for thermal characterization of stacked dice FPGA devices. 3DIC 2015: TS8.21.1-TS8.21.8

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