"Recent Developments of Cu-Cu non-thermo compression bonding for ..."

Ionut Radu et al. (2010)

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DOI: 10.1109/3DIC.2010.5751454

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka:
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6

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