"A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingemnt for ..."

Akshat Hetal Patel et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830106

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Akshat Hetal Patel, Ketan Yogi, Gopinath Sahu, Tiwei Wei:
A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingemnt for High-Performance Interposer Package. 3DIC 2024: 1-6

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