"All-wet TSV filling with highly adhesive displacement plated Cu seed layer."

Kohei Ohta et al. (2015)

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DOI: 10.1109/3DIC.2015.7334609

access: closed

type: Conference or Workshop Paper

metadata version: 2026-02-25

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Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara:
All-wet TSV filling with highly adhesive displacement plated Cu seed layer. 3DIC 2015: TS8.4.1-TS8.4.3

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