"Highly conformal and adhesive electroless barrier and Cu seed formation ..."

S. Nishizawa et al. (2013)

> Home

Details and statistics

DOI: 10.1109/3DIC.2013.6702392

access: closed

type: Conference or Workshop Paper

metadata version: 2026-02-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/NishizawaASSI13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/NishizawaASSI13
S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue:
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. 3DIC 2013: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.