"Electrical interconnect test of 3D ICs made of dies without ESD protection ..."

Kosuke Nanbara et al. (2015)

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DOI: 10.1109/3DIC.2015.7334592

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Kosuke Nanbara, Akihiro Odoriba, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu:
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. 3DIC 2015: TS8.22.1-TS8.22.5

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