"Selection of underfill material in Cu hybrid bonding and its effect on the ..."

Dau Fatt Lim, K. C. Leong, Chuan Seng Tan (2011)

> Home

Details and statistics

DOI: 10.1109/3DIC.2012.6262981

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-31

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/LimLT11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/LimLT11
Dau Fatt Lim, K. C. Leong, Chuan Seng Tan:
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. 3DIC 2011: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.