"The influence of device morphology on wafer-level bonding with ..."

Hao-Wen Liang et al. (2016)

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DOI: 10.1109/3DIC.2016.7970009

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen:
The influence of device morphology on wafer-level bonding with polymer-coated layer. 3DIC 2016: 1-4

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