"Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology ..."

K. W. Lee et al. (2015)

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DOI: 10.1109/3DIC.2015.7334471

access: closed

type: Conference or Workshop Paper

metadata version: 2021-09-06

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K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka:
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC 2015: TS1.2.1-TS1.2.4

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